| XC6VLX75T-2FFG784C | |
|---|---|
| Part Number | XC6VLX75T-2FFG784C |
| Manufacturer | AMD |
| Description | IC FPGA 360 I/O 784FCBGA |
| Quantity Available | 2887 pcs new original in stock. Request Stock & Quotation |
| ECAD Model | |
| Datasheets | XC6VLX75T-2FFG784C.pdf |
| Download | XC6VLX75T-2FFG784C Details PDF |
| XC6VLX75T-2FFG784C Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of XC6VLX75T-2FFG784C | |||
|---|---|---|---|
| Manufacturer Part Number | XC6VLX75T-2FFG784C | Category | Industrial Controls |
| Manufacturer | AMD | Description | IC FPGA 360 I/O 784FCBGA |
| Package / Case | 784-FCBGA (29x29) | Quantity Available | 2887 pcs |
| Voltage - Supply | 0.95V ~ 1.05V | Total RAM Bits | 5750784 |
| Supplier Device Package | 784-FCBGA (29x29) | Series | Virtex®-6 LXT |
| Package / Case | 784-BBGA, FCBGA | Package | Tray |
| Operating Temperature | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells | 74496 |
| Number of LABs/CLBs | 5820 | Number of I/O | 360 |
| Mounting Type | Surface Mount | Base Product Number | XC6VLX75 |
| Download | XC6VLX75T-2FFG784C PDF - DE.pdf | ||
Product Model
XC6VLX75T-2FFG784C
Introduction
High-density, high-performance FPGA part of Xilinx Virtex-6 LXT Series
Brand and Manufacturer
xilinx
Features
Embedded processing block with up to 2.38 Mbyte of block RAM
Advanced DSP slices for high-performance digital signal processing
High-speed serial connectivity with built-in gigabit transceivers
High logic capacity for flexible system integration
Energy-efficient design for reduced power consumption
Product Performance
5820 Logic Blocks for adaptable logic configuration
74496 Logic Cells supporting complex digital computations
5750784 Total RAM Bits for extensive data storage and manipulation
360 I/O Pins for versatile interfacing with external components and systems
Technical Specifications
Virtex-6 LXT FPGA technology
1.0V core voltage
Logic Cells configurable as shift registers or RAM
Dimensions, Shape, and Packaging
784-BBGA, FCBGA package form factor
Supplied in Tray packaging
Supplier Device Package dimensions: 784-FCBGA (29x29)
Quality and Reliability
High MTBF ensuring long reliable service
Stable performance across operating temperature range 0°C ~ 85°C
Product Advantages
Tailored for high-speed communication applications
Scalable and customizable logic architecture
Built-in features to minimize power usage
Product Competitiveness
Competitive logic density in its class
State-of-the-art connectivity options and speed grades
Compatibility
Compatible with various design software and development tools
Supports a wide range of digital and mixed-signal applications
Standard Certification and Compliance
Compliant with multiple industry-standard protocols and interfaces
Manufactured under stringent quality management standards
Lifespan and Sustainability
Designed to meet long-life cycle requirements of industrial and commercial applications
Eco-friendly packaging and production process
Actual Application Fields
Telecommunications infrastructure
High-performance computing systems
Aerospace and defense electronics
Industrial automation and control systems
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| XC6VLX75T-2FFG784C Image | XC6VLX75T-2FFG784C Picture | XC6VLX75T-2FFG784C PDF | |||
| XC6VLX75T-2FFG784C Datasheet | Download XC6VLX75T-2FFG784C Datasheet | Manufacturer | |||
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