XC6VLX75T-1FFG784I
Part Number XC6VLX75T-1FFG784I
Manufacturer AMD
Description IC FPGA 360 I/O 784FCBGA
Quantity Available 2804 pcs new original in stock.
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ECAD Model
Datasheets XC6VLX75T-1FFG784I.pdf
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Technical Information of XC6VLX75T-1FFG784I
Manufacturer Part Number XC6VLX75T-1FFG784I Category Industrial Controls
Manufacturer AMD Description IC FPGA 360 I/O 784FCBGA
Package / Case 784-FCBGA (29x29) Quantity Available 2804 pcs
Voltage - Supply 0.95V ~ 1.05V Total RAM Bits 5750784
Supplier Device Package 784-FCBGA (29x29) Series Virtex®-6 LXT
Package / Case 784-BBGA, FCBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of Logic Elements/Cells 74496
Number of LABs/CLBs 5820 Number of I/O 360
Mounting Type Surface Mount Base Product Number XC6VLX75
DownloadXC6VLX75T-1FFG784I PDF - DE.pdf

Product Model

XC6VLX75T-1FFG784I

Introduction

Virtex®-6 LXT FPGA for high-performance applications

Brand and Manufacturer

Xilinx

Features

Advanced FPGA architecture

High logic-to-pin ratio

Programmable digital signal processing (DSP) slices

Robust clock management system

PCI Express® compatible

Product Performance

High logic cell density for complex designs

Efficient processing with integrated DSPs

Low latency, high-speed serial connectivity

Enhanced memory capabilities

Superior signal processing performance

Technical Specifications

Manufacturer Part Number: XC6VLX75T-1FFG784I

Number of LABs/CLBs: 5820

Number of Logic Elements/Cells: 74496

Total RAM Bits: 5750784

Number of I/O: 360

Voltage - Supply: 0.95V ~ 1.05V

Mounting Type: Surface Mount

Operating Temperature: -40°C ~ 100°C (TJ)

Dimensions, Shape, and Packaging

Package / Case: 784-BBGA, FCBGA

Dimensions: Package 29x29 mm (FCBGA footprint)

Packaging: Tray

Quality and Reliability

Guaranteed performance over the full temperature range

Robust construction for long-term reliability

Product Advantages

High integration reduces the overall system footprint

Supports complex digital processing tasks

Optimized for high-speed communication protocols

Product Competitiveness

Competitive price-to-performance ratio in its class

Favored option for telecom, aerospace, and defense industries

Compatibility

Compatible with a wide range of PCBs due to its standard BGA package

Interoperable with other Xilinx components and development tools

Standard Certification and Compliance

Complies with global industry standards

Meets RoHS and Lead-free requirements

Lifespan and Sustainability

Designed for extended lifespan in high-reliability environments

Eco-friendly options available

Actual Application Fields

Data processing

Telecommunications

Military and aerospace applications

Video and image processing

Industrial automation

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