MT49H16M18CBM-25:B
Part Number MT49H16M18CBM-25:B
Manufacturer Micron Technology Inc.
Description IC DRAM 288MBIT PARALLEL 144UBGA
Quantity Available 3160 pcs new original in stock.
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Datasheets 1.MT49H16M18CBM-25:B.pdf2.MT49H16M18CBM-25:B.pdf3.MT49H16M18CBM-25:B.pdf4.MT49H16M18CBM-25:B.pdf
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Technical Information of MT49H16M18CBM-25:B
Manufacturer Part Number MT49H16M18CBM-25:B Category Integrated Circuits (ICs)
Manufacturer Micron Technology Description IC DRAM 288MBIT PARALLEL 144UBGA
Package / Case 144-µBGA (18.5x11) Quantity Available 3160 pcs
Write Cycle Time - Word, Page - Voltage - Supply 1.7V ~ 1.9V
Technology DRAM Supplier Device Package 144-µBGA (18.5x11)
Series - Package / Case 144-TFBGA
Package Bulk Operating Temperature 0°C ~ 95°C (TC)
Mounting Type Surface Mount Memory Type Volatile
Memory Size 288Mbit Memory Organization 16M x 18
Memory Interface Parallel Memory Format DRAM
Clock Frequency 400 MHz Base Product Number MT49H16M18
Access Time 20 ns  
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Product Model

MT49H16M18CBM-25:B

Introduction

High capacity DRAM memory module designed for high-speed applications

Brand and Manufacturer

Micron Technology

Features

High-density 288Mbit memory module

16M x 18 memory organization for efficient data management

Parallel memory interface for rapid data transfer

Product Performance

Supports clock frequencies up to 400 MHz for high-speed operation

Fast access time of 20 ns to improve system responsiveness

Designed to operate within a wide temperature range of 0°C to 95°C

Technical Specifications

Volatile type DRAM technology

Memory size of 288Mbit

Parallel memory interface

Dimensions, Shape, and Packaging

Surface mount 144-TFBGA packaging

Dimension of 144-µBGA package is 18.5x11 mm

Quality and Reliability

Robust design capable of withstanding industrial operating conditions

Obsolescence indicates mature and stable technology

Product Advantages

Large memory size for complex applications

Relatively fast data access for DRAM technology

Product Competitiveness

Designed for systems requiring high-speed and high-density memory

Compatibility

Surface mount design is compatible with modern PCB manufacturing processes

Standard Certification and Compliance

Micron Technology adherence to industry standard specifications for DRAM

Lifespan and Sustainability

Although listed as Obsolete, the product may still be reliable for legacy systems

Actual Application Fields

Ideal for high-speed computing, telecommunications, and server applications

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