S1D137162B1
Part Number S1D137162B1
Manufacturer EPSON
Description S1D137162B1 EPSON
Quantity Available 2632 pcs new original in stock.
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Technical Information of S1D137162B1
Manufacturer Part Number S1D137162B1 Category Integrated Circuits (ICs)
Manufacturer Epson Description S1D137162B1 EPSON
Package / Case Quantity Available 2632 pcs
Package BGA Condtion New Original Stock
Warranty 100% Perfect Functions Lead Time 2-3days after payment.
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Product Model

S1D137162B1

Introduction

Specialized integrated circuit for advanced digital processing

Brand and Manufacturer

Epson

Features

Small footprint BGA package

Designed for specialized applications

High integration to reduce system complexity

Product Performance

Robust data processing capabilities

Optimized for speed and efficiency

Technical Specifications

Ball Grid Array (BGA) package type

Dimensions, Shape, and Packaging

Compact BGA packaging suited for space-constrained applications

Quality and Reliability

Manufactured to Epson's high-quality standards

Reliable performance in demanding conditions

Product Advantages

High integration offers cost-saving on additional components

Epson's reputation for durability and precision

Product Competitiveness

Stands out in the specialized IC market for its efficiency

Compatibility

Designed to be compatible with a range of digital processing systems

Standard Certification and Compliance

Complies with industry-standard certifications for integrated circuits

Lifespan and Sustainability

Long operational lifespan with sustainable performance

Actual Application Fields

Utilized in complex digital processing tasks within various electronic devices

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