CY7C1357C-100AXC
Part Number CY7C1357C-100AXC
Manufacturer Infineon Technologies
Description IC SRAM 9MBIT PAR 100TQFP
Quantity Available 3106 pcs new original in stock.
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Datasheets 1.CY7C1357C-100AXC.pdf2.CY7C1357C-100AXC.pdf3.CY7C1357C-100AXC.pdf4.CY7C1357C-100AXC.pdf
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Technical Information of CY7C1357C-100AXC
Manufacturer Part Number CY7C1357C-100AXC Category Integrated Circuits (ICs)
Manufacturer Cypress Semiconductor Description IC SRAM 9MBIT PAR 100TQFP
Package / Case 100-TQFP (14x20) Quantity Available 3106 pcs
Write Cycle Time - Word, Page - Voltage - Supply 3.135V ~ 3.6V
Technology SRAM - Synchronous, SDR Supplier Device Package 100-TQFP (14x20)
Series NoBL™ Package / Case 100-LQFP
Package Tray Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount Memory Type Volatile
Memory Size 9Mbit Memory Organization 512K x 18
Memory Interface Parallel Memory Format SRAM
Clock Frequency 100 MHz Base Product Number CY7C1357
Access Time 7.5 ns  
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Product Model

CY7C1357C-100AXC

Introduction

High-speed synchronous SRAM memory chip for electronics

Brand and Manufacturer

Infineon Technologies

Features

Volatile memory

Synchronous operation

SDR (Single Data Rate) SRAM technology

Parallel memory interface

Product Performance

Memory size of 9Mbit

Organized as 512K x 18

Supports clock frequency up to 100 MHz

Access time of 7.5 nanoseconds

Technical Specifications

Memory type: SRAM - Synchronous, SDR

Supply voltage range: 3.135V to 3.6V

Dimensions, Shape, and Packaging

Surface mount

100-LQFP package

Supplier device package: 100-TQFP (14x20)

Quality and Reliability

Designed for operation between 0°C and 70°C

Product Advantages

High-speed access

Reliable synchronous operation

Product Competitiveness

In the SRAM market for speed-critical applications

Compatibility

Parallel interface for broad device interoperability

Standard Certification and Compliance

Complies with standard electronic component regulations

Lifespan and Sustainability

Durable design, however, it is designated as obsolete

Actual Application Fields

Used in high-performance computing, networking and telecommunications equipment

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