XCKU085-2FLVB1760I
Part Number XCKU085-2FLVB1760I
Manufacturer AMD
Description IC FPGA 676 I/O 1760FCBGA
Quantity Available 503 pcs new original in stock.
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Datasheets 1.XCKU085-2FLVB1760I.pdf2.XCKU085-2FLVB1760I.pdf3.XCKU085-2FLVB1760I.pdf
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Technical Information of XCKU085-2FLVB1760I
Manufacturer Part Number XCKU085-2FLVB1760I Category Industrial Controls
Manufacturer AMD Description IC FPGA 676 I/O 1760FCBGA
Package / Case 1760-FCBGA (42.5x42.5) Quantity Available 503 pcs
Voltage - Supply 0.922V ~ 0.979V Total RAM Bits 58265600
Supplier Device Package 1760-FCBGA (42.5x42.5) Series Kintex® UltraScale™
Package / Case 1760-BBGA, FCBGA Package Tray
Operating Temperature -40°C ~ 100°C (TJ) Number of Logic Elements/Cells 1088325
Number of LABs/CLBs 62190 Number of I/O 676
Mounting Type Surface Mount Base Product Number XCKU085
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Product Model

XCKU085-2FLVB1760I

Introduction

High-performance FPGA device designed for advanced embedded systems

Brand and Manufacturer

Xilinx

Features

High logic capacity with 1,088,325 logic elements

Advanced memory architecture with 58,265,600 total RAM bits

Robust I/O capabilities with 676 I/O pins

Product Performance

Supports complex logic designs with 62,190 LABs/CLBs

Efficient power supply voltage range of 0.922V to 0.979V

Operates effectively in extreme temperatures from -40°C to 100°C

Technical Specifications

Voltage Supply: 0.922V - 0.979V

Mounting Type: Surface Mount

Operating Temperature: -40°C to 100°C

Dimensions, Shape, and Packaging

Package: 1760-BBGA, FCBGA

Dimensions: 42.5mm x 42.5mm

Packaging: Tray

Quality and Reliability

Designed for high reliability and quality in demanding conditions

Product Advantages

Optimized for high-performance and power efficiency in embedded applications

Product Competitiveness

Part of the advanced Kintex® UltraScale™ series, competitive in FPGA technology

Compatibility

Compatible with numerous design tools and software used in FPGA development

Standard Certification and Compliance

Meets industry standards for electronic components and FPGAs

Lifespan and Sustainability

Designed for long-term deployment with sustainable technology practices

Actual Application Fields

Ideal for telecommunications, data centers, aerospace, and industrial automation

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