XC4003H-5PQ208C
Part Number XC4003H-5PQ208C
Manufacturer XILINX
Description XC4003H-5PQ208C XILINX
Quantity Available 2563 pcs new original in stock.
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ECAD Model
Datasheets XC4003H-5PQ208C.pdf
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Technical Information of XC4003H-5PQ208C
Manufacturer Part Number XC4003H-5PQ208C Category Integrated Circuits (ICs)
Manufacturer XILINX Description XC4003H-5PQ208C XILINX
Package / Case Quantity Available 2563 pcs
Package QFP Condtion New Original Stock
Warranty 100% Perfect Functions Lead Time 2-3days after payment.
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Product Model

XC4003H-5PQ208C

Introduction

High-performance Field Programmable Gate Array (FPGA)

Brand and Manufacturer

Xilinx

Features

Configurable logic blocks for tailored functionality

Programmable I/O blocks

Supports multiple logic design configurations

High integration for reduced system cost

Product Performance

Capable of implementing complex logic circuits

Flexible interconnects for high-speed data transfer

Efficient power management for low-power operation

Technical Specifications

FPGA technology

5V operation voltage

208-pin Quad Flat Pack (QFP)

Dimensions, Shape, and Packaging

208-pin QFP

Rectangular, flat packaging

Typically shipped in tray or tape and reel

Quality and Reliability

High manufacturing standards

Robust thermal and electrical performance

Long-term operational stability

Product Advantages

Versatility in applications ranging from simple logic gates to complex system functions

Reprogrammable technology allows for updates and iteration

Product Competitiveness

Competes with similar FPGAs in terms of cost, performance, and flexibility

Favorable choice in terms of configurability and developer resources

Compatibility

Compatible with standard FPGA development tools

Interoperable with various design suites for hardware description languages

Standard Certification and Compliance

Complies with standard IC testing and certification protocols

Meets industry standards for electronic component safety and efficiency

Lifespan and Sustainability

Designed for prolonged lifecycle under typical usage conditions

Constructed with materials aimed at minimizing environmental impact

Actual Application Fields

Used in telecommunications, automotive systems, defense, and consumer electronics

Common in digital signal processing, prototyping, and research and development contexts

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