TMS320TCI100BZLZ7 | |
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Part Number | TMS320TCI100BZLZ7 |
Manufacturer | Texas Instruments |
Description | TMS320 - DIGITAL SIGNAL PROCESSO |
Quantity Available | 2629 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | TMS320TCI100BZLZ7.pdf |
Download | TMS320TCI100BZLZ7 Details PDF |
TMS320TCI100BZLZ7 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of TMS320TCI100BZLZ7 | |||
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Manufacturer Part Number | TMS320TCI100BZLZ7 | Category | Industrial Controls |
Manufacturer | Texas Instruments | Description | TMS320 - DIGITAL SIGNAL PROCESSO |
Package / Case | 532-FCBGA (23x23) | Quantity Available | 2629 pcs |
Voltage - I/O | 3.30V | Voltage - Core | 1.20V |
Type | Fixed Point | Supplier Device Package | 532-FCBGA (23x23) |
Series | - | Package / Case | 532-BFBGA, FCBGA |
Package | Bulk | Operating Temperature | 0°C ~ 90°C (TC) |
On-Chip RAM | 1.03125MB | Non-Volatile Memory | External |
Mounting Type | Surface Mount | Interface | DMA, EMIF, HPI, McBSP, PCI, SPI, UTOPIA |
Clock Rate | 720MHz | ||
Download | TMS320TCI100BZLZ7 PDF - DE.pdf |
TMS320TCI100BZLZ7
High-performance fixed-point digital signal processor with advanced peripherals and power management features, ideal for embedded applications.
Bulk packaging
FCBGA package with 532 pins
23x23 mm package size
Supports surface mount assembly
Thermal and electrical properties suitable for demanding applications
Powerful fixed-point DSP core with high clock speed and on-chip memory
Extensive peripheral support for enhanced system integration
Optimized power management for energy-efficient operation
Robust package and thermal characteristics for reliable performance
720 MHz clock rate
03125 MB on-chip RAM
DMA, EMIF, HPI, McBSP, PCI, SPI, UTOPIA interfaces
External non-volatile memory support
Compatible with a range of embedded systems and applications
High-performance fixed-point DSP capabilities
Flexible peripheral support for versatile system design
Power-efficient operation for battery-powered or thermally-constrained applications
Reliable package and thermal characteristics
This product is now obsolete. Customers are advised to contact our sales team for information on equivalent or alternative models that may be available.
Embedded systems
Industrial automation
Communications infrastructure
Multimedia and entertainment devices
Get a quote for this product on our website to explore how it can benefit your application. Limited time offer - contact us today!
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