Product Model

PMB6850EV1.3

Introduction

High-performance specialized integrated circuit for communication applications

Brand and Manufacturer

SIEMENS

Features

Precision engineered for advanced communication tasks

Adaptable to a variety of complex electronic systems

Product Performance

Optimized for high-speed data processing

Enhanced signal integrity

Low power consumption for energy-efficient operation

Technical Specifications

Integrated circuit category: IC

Specialization: Specialized ICs

Package type: Ball Grid Array (BGA)

Number of pins: 200

Dimensions, Shape, and Packaging

Compact BGA200 form factor

Packaged for safe transportation and storage

Quality and Reliability

Constructed to SIEMENS's high-quality standards

Rigorous testing ensures consistent performance

Product Advantages

State-of-the-art design by a reputable manufacturer

Improved system capabilities through advanced integration

Product Competitiveness

Competes with top market alternatives in specialized ICs

Compatibility

Designed to interface with various electronic components and systems

Standard Certification and Compliance

Meets relevant industry standard certifications and compliance requirements

Lifespan and Sustainability

Designed for long-term operation

Built with consideration for environmental impact and sustainability

Actual Application Fields

Used in sophisticated communication systems and devices

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