PF38F6070M0Y0CE | |
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Part Number | PF38F6070M0Y0CE |
Manufacturer | INTEL |
Description | PF38F6070M0Y0CE INTEL |
Quantity Available | 2698 pcs new original in stock. Request Stock & Quotation |
ECAD Model | |
Datasheets | |
Download | PF38F6070M0Y0CE Details PDF |
PF38F6070M0Y0CE Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
Technical Information of PF38F6070M0Y0CE | |||
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Manufacturer Part Number | PF38F6070M0Y0CE | Category | Integrated Circuits (ICs) |
Manufacturer | Intel | Description | PF38F6070M0Y0CE INTEL |
Package / Case | Quantity Available | 2698 pcs | |
Package | BGA | Condtion | New Original Stock |
Warranty | 100% Perfect Functions | Lead Time | 2-3days after payment. |
Payment | PayPal / Telegraphic Transfer / Western Union | Shipping by | DHL / Fedex / UPS |
Port | HongKong | RFQ Email | |
Download | PF38F6070M0Y0CE PDF - DE.pdf |
PF38F6070M0Y0CE
The PF38F6070M0Y0CE is a specialized integrated circuit manufactured by Intel. The model falls under the main category of Integrated Circuits (ICs), with a small classification of Specialized ICs.
The PF38F6070M0Y0CE is manufactured by Intel, a renowned and credible name in the world of technology, especially microprocessors and integrated circuits.
The PF38F6070M0Y0CE is a Ball Grid Array (BGA) packaged IC. Known for their high performance and efficiency, BGA packaged ICs provide a high number of interconnects, thus enabling complex designs.
Being a product of Intel, the PF38F6070M0Y0CE is expected to have a high-performance efficiency and superior reliability. Intel’s ICs are renowned for their fast signal processing and low power consumption.
As the details of the technical specifications are not provided, general characteristics of specialized ICs can be considered. Specialized ICs include features like power management, digital signal processing, and application-specific functions, depending on their intended application.
The PF38F6070M0Y0CE comes in a BGA package. The BGA package consists of a rectangular or square shaped chip which is physically small but packed with high interconnect density. The specific dimensions are not provided.
Intel ICs are renowned for their high quality and reliability. Their products are extensively tested to ensure optimal performance even under extreme conditions.
The main advantage of the PF38F6070M0Y0CE is its high interconnection density provided by the BGA packaging. It also offers fast signal processing and low power consumption, making it an excellent choice for complex designs.
Intel’s name in IC manufacturing industry makes this product highly competitive. Intel’s high-quality products, combined with their excellent customer support, position this IC model effectively in the market.
Because of its applications in various fields, the compatibility of this IC depends on the system in which it is being incorporated. However, due to its specialized nature, it is expected to be compatible with a variety of advanced systems.
Intel products adhere to industry-standard certifications. Although specific compliance details for this model are not provided, it is expected that the PF38F6070M0Y0CE is compliant with industry norms and certifications.
Intel products are typically designed for a long lifespan, with a focus on sustainability. Despite this, the lifespan and sustainability would ultimately depend on the specific usage scenario.
Applications for the PF38F6070M0Y0CE could potentially be vast and varied due to its "Specialized ICs" classification, which suggests it could be customized for use in a variety of fields. However, without further information, specific application fields cannot be accurately determined.
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PF38F6070M0Y0CE Image | PF38F6070M0Y0CE Picture | PF38F6070M0Y0CE PDF | |||
PF38F6070M0Y0CE Datasheet | Download PF38F6070M0Y0CE Datasheet | Manufacturer Intel |
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