Product Model

BC63B239A04-IKB-E4S

Introduction

A specialized integrated circuit designed for advanced wireless communication solutions.

Brand and Manufacturer

CSR

Features

Enables robust wireless communication

Supports advanced audio streaming capabilities

Optimized for low power consumption

High integration reduces external component needs

Product Performance

Delivers high-speed data transmission

Enhanced signal processing for improved clarity

Efficient power management for extended battery life

Technical Specifications

Package type: Ball Grid Array (BGA)

Main Category: Integrated Circuits (ICs)

Small Classification: Specialized ICs

Dimensions, Shape, and Packaging

Compact BGA package for reduced space usage

Designed for easy integration into various device form factors

Quality and Reliability

Built to high industry standards for durability

Undergoes rigorous testing for performance assurance

Product Advantages

High integration facilitates simplified circuit design

Low power consumption enhances device usability

Product Competitiveness

Stands out in the market for its high performance and reliability

Competitive pricing and superior features

Compatibility

Compatible with a wide range of audio and communication protocols

Standard Certification and Compliance

Meets global regulatory standards for electronics

Complies with environmental and safety regulations

Lifespan and Sustainability

Designed for longevity under continuous operation

Eco-friendly components minimize environmental impact

Actual Application Fields

Used in consumer electronics, communication devices, and IoT applications.

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