ADSP-BF533SBB500
Part Number ADSP-BF533SBB500
Manufacturer N/A
Description IC DSP CTLR 16BIT 500MHZ 169-BGA
Quantity Available 2863 pcs new original in stock.
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Datasheets 1.ADSP-BF533SBB500.pdf2.ADSP-BF533SBB500.pdf3.ADSP-BF533SBB500.pdf4.ADSP-BF533SBB500.pdf
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Technical Information of ADSP-BF533SBB500
Manufacturer Part Number ADSP-BF533SBB500 Category Industrial Controls
Manufacturer N/A Description IC DSP CTLR 16BIT 500MHZ 169-BGA
Package / Case 169-PBGA (19x19) Quantity Available 2863 pcs
Voltage - I/O 3.30V Voltage - Core 1.20V
Type Fixed Point Supplier Device Package 169-PBGA (19x19)
Series Blackfin® Package / Case 169-BBGA
Package Tray Operating Temperature -40°C ~ 85°C
On-Chip RAM 148kB Non-Volatile Memory ROM (1kB)
Mounting Type Surface Mount Interface SPI, SSP, UART
Clock Rate 500MHz Base Product Number ADSP-BF533
DownloadADSP-BF533SBB500 PDF - DE.pdfADSP-BF533SBB500 PDF - FR.pdfADSP-BF533SBB500 PDF - ES.pdfADSP-BF533SBB500 PDF - IT.pdfADSP-BF533SBB500 PDF - KR.pdf

Product Model

ADSP-BF533SBB500

Introduction

The ADSP-BF533SBB500 is a high-performance Blackfin digital signal processor (DSP) designed for efficient data processing in embedded applications.

Brand and Manufacturer

Analog Devices, Inc. (ADI)

Features

High computing power for signal processing

Low power consumption

Dual multiply accumulate (MAC) units

Integrated memory controllers

Supports multiple peripherals for enhanced connectivity

Product Performance

Optimized for audio, video, and voice processing applications

High-speed performance at 500 MHz

Capable of executing up to 1000 million instructions per second (MIPS)

Technical Specifications

Core architecture: Blackfin

Clock speed: 500 MHz

On-chip memory: 148 KB

Package type: Ball Grid Array (BGA)

External memory interface support

Dimensions, Shape, and Packaging

Dimensions: 17 mm x 17 mm

Shape: Square

Packaging: BGA package, typically supplied in tray or tape and reel form

Quality and Reliability

Designed to meet high industry standards for quality

Robust against environmental variations and operational stress

Long-term reliability under extended usage

Product Advantages

High integration reduces overall system cost

Flexible and scalable architecture

Power efficiency enhances battery life in portable devices

Product Competitiveness

Competitive in high-performance DSP markets

Advantageous in applications requiring intensive signal processing

Cost-effective solution compared to similar DSPs

Compatibility

Compatible with a range of external memories and peripheral devices

Supports various operating systems and development environments

Standard Certification and Compliance

Complies with industry-standard specifications for electronic components

Meets RoHS and WEEE environmental directives

Lifespan and Sustainability

Designed for long operational lifespan

Components used are selected for durability and sustainability

Actual Application Fields

Embedded systems

Audio and video processing equipment

Voice recognition systems

Industrial control systems

Telecommunications infrastructure

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