The SKM200GB173D, made by Semikron, is a main component designed to handle high voltages and currents effectively. This article explains the features, uses, and maintenance of the SKM200GB173D, along with comparisons to similar models. It’s built to perform reliably in tough settings like public transport and renewable energy systems, showing why it’s a top choice for those needing strong and stable power control.
The SKM200GB173D is an IGBT module from Semikron, tailored for robust high-power applications. It operates under a voltage rating of 1,700 V and can handle a current of up to 200 A, encapsulated within the SEMITRANS 3 package. This module is designed with features like voltage-controlled MOS input, low inductance casing, and fast, soft inverse CAL diodes, optimizing it for AC inverter drives used between 575 and 750 V AC, among other applications.
With its enhanced safety features, including a high short-circuit capability self-limiting to six times the nominal current and latch-up free operation, this component ensures reliable performance in demanding environments. The use of Direct Copper Bonding (DCB) technology provides excellent thermal management and reliability. This module is perfect for deployment in public transport systems and other high-demand electrically powered setups.
Enhance your application’s performance by integrating the SKM200GB173D—contact us today to secure your module!
Voltage-Controlled MOS Input - Facilitates efficient switching with minimal gate drive power.
N-Channel, Homogeneous Silicon Design - Ensures consistent performance and reliability.
Low Inductance Case - Reduces electromagnetic interference and enhances switching performance.
Very Low Tail Current with Low Temperature Dependence - Improves efficiency and reduces thermal stress.
High Short-Circuit Capability - Self-limiting to six times the nominal current, providing strong protection.
Latch-Up Free Operation - Enhances reliability under various operating conditions.
Fast and Soft Inverse CAL Diodes - Offer improved performance in freewheeling applications.
Isolated Copper Baseplate Using Direct Copper Bonding (DCB) Technology - Provides excellent thermal management and electrical isolation.
Large Clearance (13 mm) and Creepage Distances (20 mm) - Ensure safety and compliance with high-voltage standards.
AC Motor Drives - Controls motors in factories, HVAC systems, and machines.
Public Transport Systems - Powers converters and inverters in electric trains, trams, and buses.
Solar and Wind Energy - Converts DC to AC power in renewable energy systems.
Backup Power (UPS) - Helps keep power stable during outages or failures.
Model |
Manufacturer |
Voltage
Rating |
Current
Rating |
Notes |
SKM200GB123D |
Semikron |
1200 V |
200 A |
Lower voltage
version; suitable for similar power switching applications |
SM200GB174D |
Semikron |
1700 V |
200 A |
Similar to 173 D with
same ratings; may differ in internal construction |
SKM200GAR173D |
Semikron |
1700 V |
200 A |
Alternate layout;
includes enhanced diode performance |
BSM150GB170DN2 |
Infineon |
1700 V |
150 A |
Slightly lower
current; different package and pinout |
CM200DY-24NF |
Mitsubishi |
1200 V |
200 A |
Widely used;
compatible with many inverter systems |
Specification |
SKM200GB173D |
SKM
200GB 174 D |
Voltage Rating |
1700 V |
1700 V |
Current Rating |
200 A |
200 A |
Package Type |
SEMITRANS 3 |
SEMITRANS 3 |
Configuration |
Half-bridge IGBT |
Half-bridge IGBT |
Switching Performance |
Fast switching, soft
recovery CAL diodes |
Slight improvement in
diode recovery characteristics |
Short-Circuit
Capability |
High, with
self-limiting function |
Similar high-level
protection |
Thermal Management |
DCB baseplate for
isolation and heat dissipation |
Same DCB technology
used |
Application Focus |
General-purpose
high-voltage switching (traction, inverters) |
More optimized for
modern inverter applications and better EMI performance |
Main Difference |
Standard version in
1700 V class |
Potentially improved
internal layout or generation revision |
Advantages:
- Suitable for demanding industrial and transport applications.
- Handles heavy loads with stable performance.
- Standardized layout for easy integration and replacement.
- Minimizes voltage overshoot and EMI during switching.
- Improves system efficiency and reduces switching losses.
- Self-limiting to prevent damage under fault conditions.
- Excellent heat dissipation and electrical insulation.
- Enhances safety and reliability.
Disadvantages:
- May not be cost-effective for low-voltage applications.
- Sensitive to poor gate control—needs precise driving conditions.
- Might be too bulky for compact or space-limited designs.
Keep It Clean - Regularly remove dust and debris from the module and heatsink to prevent overheating and insulation failure.
Check Mounting Screws - Ensure the screws remain tight to maintain thermal contact and prevent vibration damage.
Monitor Temperature - Use thermal sensors or infrared checks to keep the baseplate within safe temperature limits.
Inspect for Cracks or Discoloration - Visual checks help detect signs of thermal fatigue, overheating, or mechanical stress.
Maintain Proper Cooling - Ensure heatsinks and fans are working efficiently to avoid thermal overload.
Clean Contacts - Make sure electrical terminals and connectors are clean and corrosion-free for stable operation.
Replace Thermal Paste Periodically - Refresh thermal interface material if dry or hardened to maintain good heat transfer.
The top view of the module shows the three main terminals labeled 1, 2, and 3, spaced evenly across the body with 22.5 mm between the outer terminals and a 22 mm gap between the middle and each side. These terminals likely correspond to the collector, emitter, and gate connections of the IGBT half-bridge structure. Four mounting holes, each 6.4 mm in diameter, are located at the corners to secure the module onto a heatsink or chassis, ensuring stable mechanical placement and thermal contact.
The side view reveals the overall height of the module to be approximately 30.5 mm, with distinct steps in the profile indicating terminal elevation and screw access points. The main terminal bolts are M6 screws, spaced 28 mm apart, allowing for firm electrical connections. The smaller control terminal is offset and uses a 2.8 x 0.5 mm blade connector, indicating signal-level connections like gate control or temperature sensing. The precise distances between features (e.g., 106.4 mm total length and 61.4 mm width) helps you accurately plan PCB layouts or mounting plates.
The internal circuit diagram of the SKM200GB173D reveals that the module contains two IGBT transistors configured in a half-bridge topology, along with their associated freewheeling diodes. Terminal 1 (C2) is connected to the collector of the upper IGBT, while terminal 3 (C1) connects to the collector of the lower IGBT. Terminal 2 (E2) serves as the common emitter junction between the two transistors, which also acts as the output of the half-bridge.
Each IGBT is paired with an anti-parallel diode, enabling bidirectional current flow across inductive loads and protecting the devices during switching. The gate and emitter terminals for both IGBTs are brought out separately: G1 and E1 for the lower switch, and G2 and E2 for the upper switch. These are used for gate driver connections to control switching states. This configuration is commonly used in DC-AC inverters, motor drives, and switching power supplies, where fast and efficient power conversion is required.
Semikron is a well-known company that makes parts for controlling electric power. It started in 1951 and is based in Nuremberg, Germany. Semikron designs and builds products like IGBT modules, diodes, and power blocks that are used in things such as electric vehicles, wind and solar systems, trains, and industrial machines. Some of their popular product lines include SEMITRANS, MiniSKiiP, and SKiiP. These parts help manage high voltages and currents safely and efficiently. Now working together with Danfoss, Semikron continues to provide strong, reliable solutions for companies all over the world that need smart and powerful electrical systems.
SKM200GB173D from Semikron is a standout choice for managing power in demanding environments. With its ability to reduce electrical interference and enhance safety, it’s perfect for industries looking to improve their systems' efficiency and safety. This article has covered everything from its technical details to practical maintenance tips, highlighting its advantages and versatility in various applications. If you need a reliable and efficient power solution, the SKM200GB173D is worth considering.
2025-04-01
2025-03-31
An active cooling system, such as forced air cooling with fans or a liquid cooling system, is recommended to manage the heat generated by the module during operation.
DCB technology enhances the module's thermal management and reliability by providing excellent heat dissipation and reducing thermal resistance.
Its low inductance casing helps reduce EMI, enhancing overall system performance and stability.
It should not be used in environments with extreme humidity or corrosive atmospheres without additional protective measures.
Performance can be affected by temperature changes, especially in terms of efficiency and thermal stress, emphasizing the importance of effective thermal management.
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